Quality Control
The 4-Step Inspection Process
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Step 1: Visual & Packaging Verification
Anti-counterfeit screening, label matching, and pin condition check to ensure physical integrity.
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Step 2: Radiological (X-Ray) Analysis
Lead frame inspection, void detection, and internal wire bonding check via high-precision X-Ray imaging.
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Step 3: Decapsulation (Decap) Analysis
Die authenticity verification and topology analysis to confirm original manufacturer markings.
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Step 4: Electrical & Functional Testing
Performance verification via certified 3rd-party laboratories to guarantee data-sheet compliance.
